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Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series

Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series

SKU: EDA006242102
Regular price R 859.00
Regular price Sale price R 859.00
Pay in 3, 6, or 12 monthly instalments with
FREE Shipping over R750 · R49 below · Import Taxes Included
Delivery in 8–17 business days
30-day refund / replacement
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Dispatch Facility: International Fulfillment Center (China)

Product Overview

Brand: QIANLI
1. Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge
2. To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
3. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
4. CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
6. High-temperature magnetic strong pressing prevents the stencils from bulging caused by high-temperature

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  • Match the exact product, device, model, size, colour, and variant shown in this listing.
  • Brand names are used to identify compatibility unless the listing clearly states otherwise.
  • This may be a repair or replacement part. Match the exact model, version, connector, and part type before ordering.
  • Professional installation may be required.

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R 859.00