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Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series

Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series

In Stock Processed in 0–3 calendar days
Regular price R 799.00
Regular price Sale price R 799.00

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Description
1. Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge
2. To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
3. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
4. CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
6. High-temperature magnetic strong pressing prevents the stencils from bulging caused by high-temperature

Specifications
Brand
QIANLI
Product type
Stenciling Tool
SKU
EDA006242102
Dispatch facility
International Fulfillment Center (China)
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  • Match the exact product, device, model, size, colour and variant shown in this listing.
  • Brand names are used to identify compatibility unless the listing clearly states otherwise.
  • This may be a repair or replacement part. Match the exact model, version, connector and part type before ordering.
  • Professional installation may be required.

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